Electronics Export Packaging from India

Electronics leaving India usually fail from ESD, then from crush, then from moisture. Packaging has to follow that order. We supply antistatic film and converted pouches from Peenya, including into electronics corridors such as Hong Kong. Other destinations are quoted with the same spec discipline.

Layer 1 — charge

Dissipative film or pouch with a named surface-resistance range. Not standard bubble. Not “pink if possible.”

Layer 2 — shock

If the device can still crack, add cushioning outside the ESD layer: 10mm bubble or foam. Do not generate charge by rubbing standard PE on a board.

Layer 3 — the carton and pallet

Tape the carton. Stretch-wrap the pallet. Humidity control is desiccant and carton spec; our films are not a climate chamber.

RFQ checklist

• •Resistivity range and test method.
• •Whether shielding bags are required (different product).
• •Device size and monthly pieces.
• •Destination and Incoterm.